发明授权
- 专利标题: Semiconductor module and driving device for switching element
- 专利标题(中): 半导体模块和开关元件驱动装置
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申请号: US14267513申请日: 2014-05-01
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公开(公告)号: US09373570B2公开(公告)日: 2016-06-21
- 发明人: Hideki Kawahara , Takanori Imazawa
- 申请人: DENSO CORPORATION
- 申请人地址: JP Kariya
- 专利权人: DENSO CORPORATION
- 当前专利权人: DENSO CORPORATION
- 当前专利权人地址: JP Kariya
- 代理机构: Posz Law Group, PLC
- 优先权: JP2013-108924 20130523
- 主分类号: H01L23/495
- IPC分类号: H01L23/495 ; H03K19/01 ; H03K17/04 ; H01L23/00
摘要:
A semiconductor module includes: a semiconductor element; first and second main current passages for energizing the semiconductor element, the first and second main current passages being opposed to each other in such a manner that a first energization direction of the first main current passage is opposite to a second energization direction of the second main current passage, or an angle between the first energization direction and the second energization direction is an obtuse angle; and a coil unit sandwiched between the first and second main current passages. The coil unit includes a coil, which generates an induced electromotive force when a magnetic flux interlinks with the coil, the magnetic flux being generated when current flows through the first and second main current passages.
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