Invention Grant
- Patent Title: High voltage resistor with high voltage junction termination
- Patent Title (中): 具有高压端接的高压电阻
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Application No.: US13195156Application Date: 2011-08-01
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Publication No.: US09373619B2Publication Date: 2016-06-21
- Inventor: Ru-Yi Su , Fu-Chih Yang , Chun Lin Tsai , Chih-Chang Cheng , Ruey-Hsin Liu
- Applicant: Ru-Yi Su , Fu-Chih Yang , Chun Lin Tsai , Chih-Chang Cheng , Ruey-Hsin Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L27/08 ; H01L29/40 ; H01L29/06 ; H01L49/02 ; H01L29/78 ; H01L29/861

Abstract:
Provided is a high voltage semiconductor device. The high voltage semiconductor device includes a substrate that includes a doped well disposed therein. The doped well and the substrate have opposite doping polarities. The high voltage semiconductor device includes an insulating device disposed over the doped well. The high voltage semiconductor device includes an elongate resistor disposed over the insulating device. A non-distal portion of the resistor is coupled to the doped well. The high voltage semiconductor device includes a high-voltage junction termination (HVJT) device disposed adjacent to the resistor.
Public/Granted literature
- US20130032862A1 High Voltage Resistor with High Voltage Junction Termination Public/Granted day:2013-02-07
Information query
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