Invention Grant
- Patent Title: Series connected transistor structure and method of manufacturing the same
- Patent Title (中): 串联晶体管结构及其制造方法
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Application No.: US14485541Application Date: 2014-09-12
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Publication No.: US09373620B2Publication Date: 2016-06-21
- Inventor: Chin-Chi Wang , Chien-Chih Lee , Tien-Wei Chiang , Ching-Wei Tsai , Chih-Ching Wang , Jon-Hsu Ho , Wen-Hsing Hsieh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/336 ; H01L27/088 ; H01L29/78 ; H01L29/45 ; H01L29/06 ; H01L23/528 ; H01L21/283 ; H01L21/306 ; H01L21/768 ; H01L21/31

Abstract:
A series-connected transistor structure includes a first source, a first channel-drain structure, a second channel-drain structure, a gate dielectric layer, a gate, a first drain pad and a second drain pad. The first source is over a substrate. The first channel-drain structure is over the first source and includes a first channel and a first drain thereover. The second channel-drain structure is over the first source and substantially parallel to the first channel-drain structure and includes a second channel and a second drain thereover. The gate dielectric layer surrounds the first channel and the second channel. The gate surrounds the gate dielectric layer. The first drain pad is over and in contact with the first drain. The second drain pad is over and in contact with the second drain, in which the first drain pad and the second drain pad are separated from each other.
Public/Granted literature
- US20160079239A1 SERIES-CONNECTED TRANSISTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-03-17
Information query
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