发明授权
- 专利标题: Method for manufacturing semiconductor light emitting device
- 专利标题(中): 半导体发光元件的制造方法
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申请号: US14547226申请日: 2014-11-19
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公开(公告)号: US09373753B2公开(公告)日: 2016-06-21
- 发明人: Hiroshi Katsuno , Yasuo Ohba , Shinji Yamada , Mitsuhiro Kushibe , Kei Kaneko
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: JP Minato-ku
- 专利权人: KABUSHIKI KAISHA TOSHIBA
- 当前专利权人: KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址: JP Minato-ku
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2011-042596 20110228
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L33/40 ; H01L23/00
摘要:
According to one embodiment, a semiconductor light emitting device includes a stacked structure body and an electrode. The stacked structure body has a first conductivity type first semiconductor layer including a nitride-based semiconductor, a second conductivity type second semiconductor layer including a nitride-based semiconductor, and a light emitting layer provided between the first and second semiconductor layers. The electrode has first, second and third metal layers. The first metal layer is provided on the second semiconductor layer and includes silver or silver alloy. The second metal layer is provided on the first metal layer and includes at least one element of platinum, palladium, rhodium, iridium, ruthenium, osmium. The third metal layer is provided on the second metal layer. A thickness of the third metal layer along a direction from the first toward the second semiconductor layer is equal to or greater than a thickness of the second metal layer.
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