发明授权
US09373756B2 Light emitting device and light emitting device package having the same
有权
发光器件和具有该发光器件的发光器件封装
- 专利标题: Light emitting device and light emitting device package having the same
- 专利标题(中): 发光器件和具有该发光器件的发光器件封装
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申请号: US14139452申请日: 2013-12-23
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公开(公告)号: US09373756B2公开(公告)日: 2016-06-21
- 发明人: Sang Youl Lee , Jung Hyeok Bae , Ji Hyung Moon , Jun O Song
- 申请人: LG Innotek Co., Ltd.
- 申请人地址: KR Seoul
- 专利权人: LG Innotek Co., Ltd.
- 当前专利权人: LG Innotek Co., Ltd.
- 当前专利权人地址: KR Seoul
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 优先权: KR10-2009-0081112 20090831
- 主分类号: H01L29/18
- IPC分类号: H01L29/18 ; H01L33/00 ; H01L33/48 ; H01L25/075 ; H01L33/38 ; H01L27/15
摘要:
Disclosed are a light emitting device. The light emitting device includes first and second light emitting cells on a conductive support member and having a hole. The first and second light emitting cells includes first and second semiconductor layers, and an active layer. First and second conducive layers are between the first light emitting cell and the conductive support member, and a third and fourth conductive layers are between the second light emitting cell and the conductive support member. First insulating layer is between the second and fourth conductive layers and the conductive support member. Second insulating layer is disposed in the hole. The second conductive layer is electrically connected to the first light emitting cells through the hole and the third conductive layer.
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