发明授权
- 专利标题： Electronic device package and manufacturing method thereof
- 专利标题（中）： 电子器件封装及其制造方法
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申请号： US14451452申请日： 2014-08-05
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公开(公告)号： US09373803B2公开(公告)日： 2016-06-21
- 发明人: Chi-Jen Kao , Ko-Yu Chiang , Yi-Kai Wang , Tarng-Shiang Hu
- 申请人： Wistron Corporation
- 申请人地址： TW New Taipei
- 专利权人： Wistron Corporation
- 当前专利权人： Wistron Corporation
- 当前专利权人地址： TW New Taipei
- 代理机构： Jianq Chyun IP Office
- 优先权： TW103105306A 20140218
- 主分类号： H01L51/10
- IPC分类号： H01L51/10 ; H01L51/00 ; H01L51/44 ; H01L51/52
摘要：
An electronic device package of the disclosure includes a gas barrier substrate, a base layer, an electronic device and a barrier film. The base layer is disposed on the gas barrier substrate and made of a light curing material. The electronic device is disposed on the base layer. The barrier film is disposed on the gas barrier substrate, in which the barrier film and the gas barrier substrate clad the electronic device and the base layer. The disclosure also provides a manufacturing method of an electronic device package.
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