An electronic device may have housing structures, electrical components, and other electronic device structures. Stress sensing structures may be formed using coatings on these electronic device structures. Stress sensing structures may have strip-shaped links that extend between pads or may be formed from blanket films. A stress sensing coating may be formed from a transparent thin film. The transparent thin film may be illuminated with monochromatic light while a video camera captures video images of resulting optical interference patterns. The video images may be captured during a test in which a device structure is exposed to stress from an impact between the device and an external object. Stress sensing coatings may also be formed from layers of material that develop cracks upon exposure to stress. Stress sensing structures may be used to evaluate stress during tests and to monitor stress during normal device use.