Invention Grant
- Patent Title: Semiconductor device having air-gap
- Patent Title (中): 具有气隙的半导体装置
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Application No.: US14554113Application Date: 2014-11-26
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Publication No.: US09379002B2Publication Date: 2016-06-28
- Inventor: Jung-Hoon Han , Dong-Wan Kim , Ju-Ik Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2014-0031080 20140317
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/764 ; H01L27/108 ; H01L23/532 ; G11C7/18

Abstract:
A semiconductor device includes a bit line structure located on a semiconductor substrate, an outer bit line spacer located on a first side surface of the bit line structure, an inner bit line spacer including a first part located between the bit line structure and the outer bit line spacer and a second part located between the semiconductor substrate and the outer bit line spacer, and a block bit line spacer located between the outer bit line spacer and the second part of the inner bit line spacer. A first air-gap is defined by the outer bit line spacer, the inner bit line spacer, and the block bit line spacer.
Public/Granted literature
- US20150262625A1 SEMICONDUCTOR DEVICE HAVING AIR-GAP Public/Granted day:2015-09-17
Information query
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