Invention Grant
US09379027B2 Method of utilizing trench silicide in a gate cross-couple construct
有权
在栅极交叉耦合结构中利用沟槽硅化物的方法
- Patent Title: Method of utilizing trench silicide in a gate cross-couple construct
- Patent Title (中): 在栅极交叉耦合结构中利用沟槽硅化物的方法
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Application No.: US14515140Application Date: 2014-10-15
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Publication No.: US09379027B2Publication Date: 2016-06-28
- Inventor: Ryan Ryoung-han Kim
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ditthavong & Steiner, P.C.
- Main IPC: H01L21/82
- IPC: H01L21/82 ; H01L21/8238 ; H01L27/092 ; H01L23/535

Abstract:
A method of forming a logic cell utilizing a TS gate cross-couple construct and the resulting device are provided. Embodiments include forming active fins and dummy fins on a substrate, the dummy fins adjacent to each other and between the active fins; forming STI regions between and next to the active and dummy fins; forming gate structures in parallel across the active and dummy fins; forming a gate cut region by cutting the gate structures between the dummy fins; forming a TS layer between the gate structures, the TS layer crossing the gate cut region; and forming a contact connecting a gate structure and the TS layer on a first side of the gate cut region and forming a contact connecting a gate structure and the TS layer on a second side of the gate cut region, the TS layer and contacts cross coupling the gate structures.
Public/Granted literature
- US20160111341A1 METHOD OF UTILIZING TRENCH SILICIDE IN A GATE CROSS-COUPLE CONSTRUCT Public/Granted day:2016-04-21
Information query
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