Invention Grant
- Patent Title: Single inline no-lead semiconductor package
- Patent Title (中): 单列直插无铅半导体封装
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Application No.: US14255935Application Date: 2014-04-17
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Publication No.: US09379071B2Publication Date: 2016-06-28
- Inventor: Tonny Kamphuis , Jan Gulpen , Jan Willem Bergman
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L23/29 ; H01L23/31
Abstract:
Embodiments of a packaged semiconductor device with no leads are disclosed. One embodiment includes a semiconductor chip and a no leads package structure defining a boundary and having a bottom surface and includes three or more pads exposed at the bottom surface of the package structure. Each of the pads is located in a single inline row.
Public/Granted literature
- US20150303156A1 SINGLE INLINE NO-LEAD SEMICONDUCTOR PACKAGE Public/Granted day:2015-10-22
Information query
IPC分类:
