Invention Grant
- Patent Title: Chip package and method for forming the same
- Patent Title (中): 芯片封装及其形成方法
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Application No.: US14552186Application Date: 2014-11-24
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Publication No.: US09379072B2Publication Date: 2016-06-28
- Inventor: Chien-Hung Liu , Ying-Nan Wen
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Main IPC: H01L31/00
- IPC: H01L31/00 ; H01L23/00 ; H01L25/00 ; H01L27/146

Abstract:
A chip package including a first substrate is provided. A plurality of first conductive pads is disposed on a first side of the first substrate. A second substrate is attached onto a second side opposite to the first side of the first substrate. The second substrate includes a micro-electric element and has a plurality of second conductive pads corresponding to the plurality of first conductive pads, disposed on a first side of the second substrate and between the first substrate and the second substrate. A redistribution layer is disposed on a second side opposite to the first side of the second substrate. The redistribution layer penetrates the second substrate, second conductive pads and the first substrate and extends into the first conductive pads to electrically connect the first and second conductive pads.
Public/Granted literature
- US20150145094A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2015-05-28
Information query
IPC分类: