Invention Grant
- Patent Title: Semiconductor device and manufacturing method the same
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Application No.: US14692077Application Date: 2015-04-21
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Publication No.: US09379141B2Publication Date: 2016-06-28
- Inventor: Shunpei Yamazaki , Hiroki Ohara , Junichiro Sakata , Toshinari Sasaki , Miyuki Hosoba
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2009-164197 20090710
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L27/12 ; H01L29/66 ; H01L29/04

Abstract:
An object is to manufacture and provide a highly reliable semiconductor device including a thin film transistor with stable electric characteristics. In a method for manufacturing a semiconductor device including a thin film transistor in which a semiconductor layer including a channel formation region serves as an oxide semiconductor film, heat treatment for reducing impurities such as moisture (heat treatment for dehydration or dehydrogenation) is performed after an oxide insulating film serving as a protective film is formed in contact with an oxide semiconductor layer. Then, the impurities such as moisture, which exist not only in a source electrode layer, in a drain electrode layer, in a gate insulating layer, and in the oxide semiconductor layer but also at interfaces between the oxide semiconductor film and upper and lower films which are in contact with the oxide semiconductor layer, are reduced.
Public/Granted literature
- US20150228667A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THE SAME Public/Granted day:2015-08-13
Information query
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