Invention Grant
- Patent Title: Method for manufacturing array substrate and method for forming through hole
- Patent Title (中): 阵列基板的制造方法及通孔的形成方法
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Application No.: US14429247Application Date: 2014-07-18
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Publication No.: US09379146B2Publication Date: 2016-06-28
- Inventor: Li Zhang , Liangchen Yan , Fengjuan Liu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Banner & Witcoff, Ltd.
- Priority: CN201310542331 20131105
- International Application: PCT/CN2014/082559 WO 20140718
- International Announcement: WO2015/067069 WO 20150514
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/283 ; H01L27/12 ; H01L29/417 ; H01L29/423 ; H01L29/66
Abstract:
A method for manufacturing an array substrate and a method for forming a through hole are provided. The method for manufacturing the array substrate comprise: coating photoresist in an insulating layer through-hole region on a substrate; depositing an insulating layer on the substrate provided with the photoresist in the insulating layer through-hole region; and stripping off the photoresist in the insulating layer through-hole region to form an insulating layer through hole. The manufacturing method simplifies the process of forming the insulating layer through hole.
Public/Granted literature
- US20160013220A1 METHOD FOR MANUFACTURING ARRAY SUBSTRATE AND METHOD FOR FORMING THROUGH HOLE Public/Granted day:2016-01-14
Information query
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