Invention Grant
- Patent Title: LED light source package
- Patent Title (中): LED光源封装
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Application No.: US14296188Application Date: 2014-06-04
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Publication No.: US09379297B2Publication Date: 2016-06-28
- Inventor: Byung Seo Yoon , Seong Yong Hwang , Kyung Min Kim , Young Min Park
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR
- Agency: Innovation Counsel LLP
- Priority: KR10-2014-0013715 20140206
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/072 ; H01L33/58 ; G02B3/00
Abstract:
Provided is a LED light source package comprising a circuit board, a light source seated on an upper portion of the circuit board, and a lens structure arranged on the upper portion of the circuit board via the light source. A surface that faces the light source in the lens structure includes a first inclined surface that projects toward the light source as going to a center portion of the lens structure.
Public/Granted literature
- US20150219286A1 LED LIGHT SOURCE PACKAGE Public/Granted day:2015-08-06
Information query
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