Invention Grant
US09379315B2 Memory cells, methods of fabrication, semiconductor device structures, and memory systems
有权
存储单元,制造方法,半导体器件结构和存储器系统
- Patent Title: Memory cells, methods of fabrication, semiconductor device structures, and memory systems
- Patent Title (中): 存储单元,制造方法,半导体器件结构和存储器系统
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Application No.: US13797185Application Date: 2013-03-12
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Publication No.: US09379315B2Publication Date: 2016-06-28
- Inventor: Wei Chen , Sunil Murthy , Witold Kula
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: G11B5/31
- IPC: G11B5/31 ; H01L43/12 ; H01L43/08

Abstract:
Magnetic memory cells, methods of fabrication, semiconductor device structures, and memory systems are disclosed. A magnetic cell core includes at least one magnetic region (e.g., a free region or a fixed region) configured to exhibit a vertical magnetic orientation, at least one oxide-based region, which may be a tunnel junction region or an oxide capping region, and at least one magnetic interface region, which may comprise or consist of iron (Fe). In some embodiments, the magnetic interface region is spaced from at least one oxide-based region by a magnetic region. The presence of the magnetic interface region enhances the perpendicular magnetic anisotropy (PMA) strength of the magnetic cell core. In some embodiments, the PMA strength may be enhanced more than 50% compared to that of the same magnetic cell core structure lacking the magnetic interface region.
Public/Granted literature
- US20140264663A1 MEMORY CELLS, METHODS OF FABRICATION, SEMICONDUCTOR DEVICE STRUCTURES, AND MEMORY SYSTEMS Public/Granted day:2014-09-18
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