Invention Grant
- Patent Title: Robot and substrate handling apparatus including the same
- Patent Title (中): 包括其的机器人和基板处理装置
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Application No.: US14643702Application Date: 2015-03-10
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Publication No.: US09381653B2Publication Date: 2016-07-05
- Inventor: Byeongsang Kim , Kang-Min Park , Jungjun Park , JaeChul Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, PLC
- Priority: KR10-2014-0027896 20140310
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B25J19/00 ; B25J15/00 ; B25J11/00
Abstract:
The robot including a main body, an arm connected to the main body, a hand connected to the arm, the hand including a hand base and a finger, and a hand bracket unit between the hand base and the finger or between the hand base and the arm, may be provided. The hand bracket unit may include a vibration damping member provided between the hand base and the finger or between the hand base and the arm, thereby damping vibration of the hand base or the finger.
Public/Granted literature
- US20150251323A1 ROBOT AND SUBSTRATE HANDLING APPARATUS INCLUDING THE SAME Public/Granted day:2015-09-10
Information query
IPC分类:
