Invention Grant
US09381759B2 Method and system for applying materials on a substrate 有权
在衬底上施加材料的方法和系统

Method and system for applying materials on a substrate
Abstract:
Embodiments of the invention are directed to a method of printing lines. A method may include positioning a plurality of print units according to a predefined spacing parameter. A method may include depositing material on a substrate by a plurality of print units to form a respective plurality of parallel lines according to a predefined spacing parameter. A printing unit may be positioned at an angle with respect to a predefined scan direction such that a predefined width of a printed line is achieved. A substrate may be rotated between scans such that a plurality of lines in a respective plurality of directions is printed in a scan direction.
Public/Granted literature
Information query
Patent Agency Ranking
0/0