Invention Grant
- Patent Title: ST2 antigen binding proteins
- Patent Title (中): ST2抗原结合蛋白
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Application No.: US13897096Application Date: 2013-05-17
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Publication No.: US09382318B2Publication Date: 2016-07-05
- Inventor: Dirk E. Smith , Ian Foltz , Chadwick T. King , Ai Ching Lim , Rutilio Clark , Michael R. Comeau , Randal R. Ketchem , Donghui Shi , Xiaoshan Min , Zhulun Wang
- Applicant: Amgen Inc.
- Applicant Address: US CA Thousand Oaks
- Assignee: Amgen Inc.
- Current Assignee: Amgen Inc.
- Current Assignee Address: US CA Thousand Oaks
- Agency: McNeill Baur PLLC
- Main IPC: C07K16/24
- IPC: C07K16/24 ; C12N15/11 ; C07K16/28 ; A61K39/00

Abstract:
Described herein are compositions and methods related to antigen binding proteins that bind to human ST2, including antibodies. In particular embodiments, the disclosure provides fully human anti-ST2 antibodies and deriviatives and variants thereof. Further provided are nucleic acids encoding such antibodies and antibody fragments, variants, and derivatives. Also, provided are methods of making and using such antibodies including methods of treating and preventing autoimmune and inflammatory disorders.
Public/Granted literature
- US20140004107A1 ST2 ANTIGEN BINDING PROTEINS Public/Granted day:2014-01-02
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