Invention Grant
- Patent Title: Lanthanum target for sputtering
- Patent Title (中): 用于溅射的镧靶
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Application No.: US13148324Application Date: 2010-03-17
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Publication No.: US09382612B2Publication Date: 2016-07-05
- Inventor: Shiro Tsukamoto , Tomio Otsuki
- Applicant: Shiro Tsukamoto , Tomio Otsuki
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Howson & Howson LLP
- Priority: JP2009-084078 20090331
- International Application: PCT/JP2010/054494 WO 20100317
- International Announcement: WO2010/113638 WO 20101007
- Main IPC: C23C14/14
- IPC: C23C14/14 ; B22D21/00 ; B22D7/00 ; B22D25/02 ; C23C14/34 ; B21J1/02 ; B21J1/04 ; C22F1/16 ; H01J37/34

Abstract:
Provided are a lanthanum target for sputtering which has a recrystallized structure with an average crystal grain size of 100 μm or less and has no spotty macro patterns on the surface; and a method of producing a lanthanum target for sputtering, wherein lanthanum is melted and cast to produce an ingot, the ingot is subject to knead forging at a temperature of 300 to 500° C. and subsequently subject to hot upset forging to form the shape into a rough target shape, and this is additionally subject to machining to obtain a target. This invention aims to offer technology for efficiently and stably providing a lanthanum target for sputtering which has no spotty macro patterns on the surface, and a method of producing the same.
Public/Granted literature
- US20110308940A1 Lanthanum Target for Sputtering Public/Granted day:2011-12-22
Information query
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