发明授权
- 专利标题: Heat dissipating module
- 专利标题(中): 散热模块
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申请号: US13900523申请日: 2013-05-22
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公开(公告)号: US09383787B2公开(公告)日: 2016-07-05
- 发明人: Ming-Fang Tsai , Ming-Hsiu Wu , Ching Ho , Yen-Chao Huang
- 申请人: Ming-Fang Tsai , Ming-Hsiu Wu , Ching Ho , Yen-Chao Huang
- 申请人地址: TW Taipei
- 专利权人: ASUSTeK COMPUTER INC.
- 当前专利权人: ASUSTeK COMPUTER INC.
- 当前专利权人地址: TW Taipei
- 代理机构: Jianq Chyun IP Office
- 主分类号: G06F1/20
- IPC分类号: G06F1/20
摘要:
A heat dissipating module disposed at a motherboard includes a fan, a air guiding cover, a first fin set and a second fin set. The fan provides cool air and is disposed in the air guiding cover. The air guiding cover includes a first air outlet, a second air outlet and an air guiding part connected between the first air outlet and the second air outlet. The first fin set is disposed at an upper surface of the motherboard and includes a plurality of first fins. The first air outlet covers at least a part of the first fins. The second fin set is disposed at a bottom surface opposite to the upper surface and extends to a side edge of the motherboard. The second fin set includes a plurality of second fins located beside the side edge, and the second air outlet covers the second fins.
公开/授权文献
- US20130319641A1 HEAT DISSIPATING MODULE 公开/授权日:2013-12-05