Invention Grant
US09385153B2 Image sensor device with flexible interconnect layer and related methods
有权
具有柔性互连层的图像传感器装置及相关方法
- Patent Title: Image sensor device with flexible interconnect layer and related methods
- Patent Title (中): 具有柔性互连层的图像传感器装置及相关方法
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Application No.: US14740468Application Date: 2015-06-16
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Publication No.: US09385153B2Publication Date: 2016-07-05
- Inventor: Jing-En Luan
- Applicant: STMICROELECTRONICS PTE LTD
- Applicant Address: SG Singapore
- Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee: STMICROELECTRONICS PTE LTD
- Current Assignee Address: SG Singapore
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Priority: CN201410537531 20141011
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/146

Abstract:
An image sensor device may include an interconnect layer having an opening extending therethrough, an image sensor IC within the opening and having an image sensing surface, and an IR filter aligned with the image sensing surface. The image sensor device may include an encapsulation material laterally surrounding the image sensor IC and filling the opening, and a flexible interconnect layer coupled to the interconnect layer opposite the image sensing surface.
Public/Granted literature
- US20160104737A1 IMAGE SENSOR DEVICE WITH FLEXIBLE INTERCONNECT LAYER AND RELATED METHODS Public/Granted day:2016-04-14
Information query
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