Invention Grant
- Patent Title: Cutting apparatus
- Patent Title (中): 切割设备
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Application No.: US14195178Application Date: 2014-03-03
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Publication No.: US09386176B2Publication Date: 2016-07-05
- Inventor: Mitsuhiro Iida , Tomoyasu Niizeki , Katsuhisa Hasegawa , Junnosuke Matsuda
- Applicant: Mitsuhiro Iida , Tomoyasu Niizeki , Katsuhisa Hasegawa , Junnosuke Matsuda
- Applicant Address: JP Nagoya-shi
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Nagoya-shi
- Agency: Fox Rothschild LLP
- Priority: JP2013-042658 20130305
- Main IPC: B41J15/14
- IPC: B41J15/14 ; H04N1/00 ; B26D1/04 ; B41J29/17 ; G03G15/00

Abstract:
A cutting apparatus includes a housing formed with an insertion hole, a transfer unit configured to transfer an object inserted through the insertion hole, a reading unit configured to read an image of the object, a platen located opposite the reading unit, and a cutting unit. The reading unit includes a light-transmitting plate. The housing encloses the reading unit, the transfer unit, the platen and the cutting unit. The platen includes a part openable and closable so that a surface of the light-transmitting plate is externally exposed. The platen includes a first platen having a flat surface and a second platen which has a flat surface and is opposed to the surface of the light-transmitting plate and is openable and closable. The second platen is engaged with the first platen so that the flat surface of the second platen is flush with the flat surface of the first platen.
Public/Granted literature
- US20140251103A1 CUTTING APPARATUS Public/Granted day:2014-09-11
Information query
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