Invention Grant
- Patent Title: Inter-frame spacing duration for sub-1 gigahertz wireless networks
- Patent Title (中): 1千兆赫兹无线网络的帧间间隔时间
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Application No.: US13901193Application Date: 2013-05-23
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Publication No.: US09386584B2Publication Date: 2016-07-05
- Inventor: Tevfik Yucek , Simone Merlin , Hemanth Sampath , Didier Johannes Richard Van Nee
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Toler Law Group, PC
- Main IPC: H04L12/413
- IPC: H04L12/413 ; H04W72/04 ; H04W74/08

Abstract:
Systems and methods of performing communication via a sub-1 gigahertz wireless network are disclosed. Values of one or more inter-frame spacing parameters for use in communication via the sub-1 gigahertz wireless network are also defined. The parameters may include a short inter-frame spacing (SIFS) time of 160 microseconds (μs). The parameters may also include a clear channel assessment (CCA) time of 40 μs. Additional parameters, such as air propagation time are also defined (e.g., for inclusion into a standard, such as Institute of Electrical and Electronics Engineers (IEEE) 802.11ah).
Public/Granted literature
- US20130329702A1 Inter-Frame Spacing Duration for Sub-1 Gigahertz Wireless Networks Public/Granted day:2013-12-12
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