Invention Grant
- Patent Title: Gas enclosure assembly and system and related printing maintenance methods
- Patent Title (中): 气体罩组件及系统及相关打印维护方法
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Application No.: US14637301Application Date: 2015-03-03
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Publication No.: US09387709B2Publication Date: 2016-07-12
- Inventor: Justin Mauck , Alexander Sou-Kang Ko , Eliyahu Vronsky , Shandon Alderson
- Applicant: Kateeva, Inc.
- Applicant Address: US CA Newark
- Assignee: Kateeva Inc.
- Current Assignee: Kateeva Inc.
- Current Assignee Address: US CA Newark
- Main IPC: B41J2/01
- IPC: B41J2/01 ; B41J29/17 ; H01L33/00 ; B41J2/165 ; H01L21/67 ; F24F3/16 ; H01L51/56 ; B41J29/13 ; H01L51/00

Abstract:
The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.
Public/Granted literature
- US20150224800A1 Gas Enclosure Assembly and System Public/Granted day:2015-08-13
Information query
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