Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14274888Application Date: 2014-05-12
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Publication No.: US09389477B2Publication Date: 2016-07-12
- Inventor: Shunpei Yamazaki , Hisashi Ohtani
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP9-022077 19970120; JP9-123088 19970426
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/786 ; G02F1/1362 ; H01L29/04 ; H01L29/66 ; H01L27/12 ; G02F1/1345

Abstract:
A semiconductor device includes TFTs designed in accordance with characteristics of circuits. In a first structure of the invention, the TFT is formed by using a crystalline silicon film made of a unique crystal structure body. The crystal structure body has a structure in which rod-like or flattened rod-like crystals grow in a direction parallel to each other. In a second structure of the invention, growth distances of lateral growth regions are made different from each other in accordance with channel lengths, of the TFTs. By this, characteristics of TFTs formed in one lateral growth region can be made as uniform as possible.
Public/Granted literature
- US20140247412A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-09-04
Information query
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