发明授权
- 专利标题: Method and device for testing defect using SEM
- 专利标题(中): 使用SEM测试缺陷的方法和装置
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申请号: US13520210申请日: 2010-12-22
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公开(公告)号: US09390490B2公开(公告)日: 2016-07-12
- 发明人: Yuji Takagi , Minoru Harada , Ryo Nakagaki , Naoki Hosoya , Toshifumi Honda , Takehiro Hirai
- 申请人: Yuji Takagi , Minoru Harada , Ryo Nakagaki , Naoki Hosoya , Toshifumi Honda , Takehiro Hirai
- 申请人地址: JP Tokyo
- 专利权人: HITACHI HIGH-TECHNOLOGIES CORPORATION
- 当前专利权人: HITACHI HIGH-TECHNOLOGIES CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Baker Botts L.L.P.
- 优先权: JP2010-000629 20100105; JP2010-056912 20100315
- 国际申请: PCT/JP2010/007409 WO 20101222
- 国际公布: WO2011/083540 WO 20110714
- 主分类号: H04N7/18
- IPC分类号: H04N7/18 ; G06T7/00 ; H01L21/66
摘要:
In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large.
公开/授权文献
- US20130070078A1 METHOD AND DEVICE FOR TESTING DEFECT USING SEM 公开/授权日:2013-03-21