Invention Grant
- Patent Title: Apparatus and method for traversing hierarchical acceleration structure
- Patent Title (中): 横向分层加速结构的装置和方法
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Application No.: US13870073Application Date: 2013-04-25
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Publication No.: US09390545B2Publication Date: 2016-07-12
- Inventor: Jae Don Lee , Young Sam Shin , Won Jong Lee , Shi Hwa Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2012-0068424 20120626
- Main IPC: G06T15/06
- IPC: G06T15/06

Abstract:
An apparatus and method for traversing a hierarchical acceleration structure may determine whether a current traversal node is a leaf node, may calculate a first distance from the current traversal node to a pop level and a second distance from a root node to the pop level when the current traversal node is the leaf node, and may determine a hierarchical traversal restarting position by comparing the first distance and the second distance.
Public/Granted literature
- US20130342528A1 APPARATUS AND METHOD FOR TRAVERSING HIERARCHICAL ACCELERATION STRUCTURE Public/Granted day:2013-12-26
Information query
IPC分类:
G | 物理 |
G06 | 计算;推算或计数 |
G06T | 一般的图像数据处理或产生 |
G06T15/00 | 3D〔三维〕图像的加工 |
G06T15/06 | .光线跟踪 |