Invention Grant
- Patent Title: Composite electronic component and board with the same mounted thereon
- Patent Title (中): 复合电子部件和安装在其上的板
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Application No.: US14275469Application Date: 2014-05-12
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Publication No.: US09390862B2Publication Date: 2016-07-12
- Inventor: Byeong Cheol Moon , Jae Hoon Lee , Myeong Gi Kim , Jin Woo Hahn , Soo Hwan Son
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0009382 20140127
- Main IPC: H01G4/40
- IPC: H01G4/40 ; H01G4/30 ; H01G4/12 ; H01G4/012 ; H05K1/18 ; H01F27/28 ; H01F27/29 ; H01F27/24 ; H05K1/11 ; H01G2/06 ; H01G4/248 ; H01F27/40

Abstract:
A composite electronic component may include: a composite body having a capacitor and an inductor coupled to each other therein; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on a lower surface of the capacitor of the composite body; and a ground terminal disposed on the lower surface of the capacitor of the composite body. The capacitor may be coupled to a side surface of the inductor.
Public/Granted literature
- US20150213960A1 COMPOSITE ELECTRONIC COMPONENT AND BOARD WITH THE SAME MOUNTED THEREON Public/Granted day:2015-07-30
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