Invention Grant
- Patent Title: Semiconductor devices having plug insulators
- Patent Title (中): 具有插头绝缘体的半导体器件
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Application No.: US14481932Application Date: 2014-09-10
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Publication No.: US09390961B2Publication Date: 2016-07-12
- Inventor: Mong-Sup Lee , Byoung-Yong Gwak , Byung-Ho Kwak , Yoon-Kyung Kim , Tae-Joon Park , Byung-Sul Ryu , In-Seak Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley
- Priority: KR10-2013-0155763 20131213
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L21/762 ; H01L27/108

Abstract:
Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes a first bit line structure extending in a first direction, a second bit line structure extending in the first direction and spaced apart from the first bit line structure, a storage contact plug located between the first bit line structure and the second bit line structure, and extending in a second direction perpendicular to the first direction, a first plug insulator located between the first bit line structure and the second bit line structure, and configured to contact a side surface extending in the second direction of the storage contact plug, and a plug isolation pattern located between the first bit line structure and the first plug insulator.
Public/Granted literature
- US20150171163A1 Semiconductor Device and Method of Fabricating the Same Public/Granted day:2015-06-18
Information query
IPC分类: