Invention Grant
- Patent Title: Semiconductor devices including empty spaces and methods of forming the same
- Patent Title (中): 包括空位的半导体装置及其形成方法
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Application No.: US14274002Application Date: 2014-05-09
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Publication No.: US09391138B2Publication Date: 2016-07-12
- Inventor: Hong-Rae Kim , Byoung-Deog Choi , Hee-Young Park , Sang-Ho Roh , Jin-Hyung Park , Kyung-Mun Byun
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sbiley, P.A.
- Priority: KR10-2013-0069032 20130617
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/764 ; H01L27/108

Abstract:
Semiconductor devices including empty spaces and methods of forming the semiconductor devices are provided. The semiconductor devices may include first and second line structures extending in a direction on a substrate, an insulating isolation pattern between the first and second line structures and a conductive structure between the first and second line structures and next to the insulating isolation pattern along the direction. The semiconductor devices may also include an empty space including a first portion between the first line structure and the conductive structure and a second portion between the first line structure and the insulating isolation pattern. The first portion of the empty space may have a height different from a height of the second portion of the empty space.
Public/Granted literature
- US20140367825A1 SEMICONDUCTOR DEVICES INCLUDING EMPTY SPACES AND METHODS OF FORMING THE SAME Public/Granted day:2014-12-18
Information query
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