Invention Grant
- Patent Title: Substrate arrangement
- Patent Title (中): 基板安排
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Application No.: US14673201Application Date: 2015-03-30
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Publication No.: US09391147B2Publication Date: 2016-07-12
- Inventor: Robert James Pascoe Lander
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP14164634 20140414
- Main IPC: H01L29/267
- IPC: H01L29/267 ; H01L21/02 ; H01L29/20 ; H01L21/762

Abstract:
A substrate arrangement comprising a substrate having a surface configured to receive, by epitaxy, an epitaxial layer of semiconducting material, the substrate comprising a laminate having a handle layer and a seed layer, the seed layer having a crystal orientation arranged to receive the epitaxial layer and the handle layer having a crystal orientation different to the seed layer.
Public/Granted literature
- US20150295052A1 SUBSTRATE ARRANGEMENT Public/Granted day:2015-10-15
Information query
IPC分类: