Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14458288Application Date: 2014-08-13
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Publication No.: US09391186B2Publication Date: 2016-07-12
- Inventor: Jae Hoon Lee , Chan Ho Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0152569 20131209
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/04 ; H01L29/267 ; H01L29/66 ; H01L29/10 ; H01L29/20

Abstract:
A semiconductor device may include: a first semiconductor layer having a first band gap; a second semiconductor layer including first and second regions separately disposed on an upper surface of the first semiconductor layer and having a second band gap wider than the first band gap; and a third semiconductor layer disposed between the first and second regions of the second semiconductor layer, extending up to at least a portion of the first semiconductor layer. The third semiconductor layer may have a channel region doped with an impurity.
Public/Granted literature
- US20150162427A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-06-11
Information query
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