Invention Grant
- Patent Title: Light emitting device package and method of fabricating the same
- Patent Title (中): 发光器件封装及其制造方法
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Application No.: US14741183Application Date: 2015-06-16
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Publication No.: US09391249B2Publication Date: 2016-07-12
- Inventor: Munheon Hong , Sangcheon Kim , Chilkeun Park , Muntae Jung
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2014-0136889 20141010; KR10-2015-0018134 20150205
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/58 ; G02F1/1335 ; H01L33/56 ; H01L33/50
Abstract:
A light emitting device package including a light emitting device; an encapsulant configured to cover the light emitting device; a first material mixed with the encapsulant to scatter light emitted from the light emitting device or convert a wavelength; and a second material mixed with the encapsulant, and disposed on a layer different from that of the first material in the encapsulant to scatter or wavelength-convert at least part of light scattered and wavelength-converted from the first material.
Public/Granted literature
- US20160104827A1 LIGHT EMITTING DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME Public/Granted day:2016-04-14
Information query
IPC分类:
