The present invention relates to a camera module, the camera module including: a PCB (Printed Circuit Board), an image sensor mounted on the PCB and formed with an imaging device for converting light to an electrical signal; a housing fixed a bottom end to an upper surface of the PCB, the housing being a case formed with a hole at an upper center and having a bottom-opened inner space: a lens assembly having at least one lens aligned to the lens hole by being positioned at and contacted to an upper surface of the image sensor and accommodated at an inner space of the housing; and an elastic stiffening material inserted between a lens hole periphery at an upper inner side of the housing and an upper edge of the lens assembly.