发明授权
- 专利标题： Multi-stacked electronic device with defect-free solder connection
- 专利标题（中）： 多层电子器件，无缺陷焊接
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申请号： US14332776申请日： 2014-07-16
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公开(公告)号： US09392691B2公开(公告)日： 2016-07-12
- 发明人: Ai Kiar Ang , Michael Lauri
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Scully, Scott, Murphy & Presser, P.C.
- 代理商 Damion Josephs, Esq.
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H05K1/11 ; H05K1/18 ; H05K3/32 ; H05K3/34 ; H05K1/14
摘要：
A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.
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