Invention Grant
- Patent Title: Modular enclosure
- Patent Title (中): 模块化外壳
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Application No.: US14245588Application Date: 2014-04-04
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Publication No.: US09392708B2Publication Date: 2016-07-12
- Inventor: Bruce R. Conway , Hyo Chang Yun , Peter J. Dutton , Thomas D. Ratzlaff , Paul Craig Tally , James O'Keeffe , Erling Hansen
- Applicant: Tyco Electronics Corporation
- Applicant Address: US PA Berwyn
- Assignee: TYCO ELECTRONICS CORPORATION
- Current Assignee: TYCO ELECTRONICS CORPORATION
- Current Assignee Address: US PA Berwyn
- Main IPC: A47B87/00
- IPC: A47B87/00 ; H05K5/00 ; H05K7/14

Abstract:
An enclosure includes a plurality of modular construction units that connect together to at least partially define an internal compartment of the enclosure. Each construction unit includes a wall segment extending a length from a corner end to a free end, and a corner segment extending outward from the corner end of the wall segment. The corner segment is integrally formed with the wall segment. The corner segment includes a receiver socket that is configured to receive the free end of another corresponding construction unit therein to connect the construction units together. The construction units connect together one after the other with a chasing symmetry to define the internal compartment of the enclosure.
Public/Granted literature
- US20150289388A1 Modular Enclosure Public/Granted day:2015-10-08
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