Invention Grant
- Patent Title: Driver assembly and method for manufacturing the same
- Patent Title (中): 驱动器组件及其制造方法
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Application No.: US14355258Application Date: 2012-10-10
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Publication No.: US09392716B2Publication Date: 2016-07-12
- Inventor: MingTao Wang , Guoan He , LiBo Wu
- Applicant: OSRAM GmbH
- Applicant Address: DE Munich
- Assignee: OSRAM GMBH
- Current Assignee: OSRAM GMBH
- Current Assignee Address: DE Munich
- Agency: Viering, Jentschura & Partner mbB
- Priority: CN201110344449 20111103
- International Application: PCT/EP2012/070021 WO 20121010
- International Announcement: WO2013/064343 WO 20130510
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/02 ; F21K99/00 ; H05K13/00 ; F21V19/00 ; F21Y101/02
Abstract:
A driver assembly includes a driver housing and a driver, the driver including at least one first portion and a second portion, the first portion having a lower heat resistance than the second portion, wherein the driver housing includes at least one first cavity for at least partially accommodating the first portion and a second cavity for accommodating the second portion, and a potting material is potted into the first cavity to envelop the first portion.
Public/Granted literature
- US20140247563A1 DRIVER ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-09-04
Information query
