Invention Grant
- Patent Title: Flooring system
- Patent Title (中): 地板系统
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Application No.: US14566274Application Date: 2014-12-10
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Publication No.: US09394697B2Publication Date: 2016-07-19
- Inventor: Sunil Ramachandra
- Applicant: ARMSTRONG WORLD INDUSTRIES, INC.
- Applicant Address: US PA Lancaster
- Assignee: AFI Licensing LLC
- Current Assignee: AFI Licensing LLC
- Current Assignee Address: US PA Lancaster
- Main IPC: E04B2/00
- IPC: E04B2/00 ; E04F15/02 ; E04F15/10 ; B32B37/12

Abstract:
Described herein are flooring systems comprising: a first floor panel and a second floor panel, each of the first and second floor panels comprising: a top surface, a bottom surface, and a plurality of peripheral edges extending between the top and bottom surfaces; and a coupling surface formed on one peripheral edge; the coupling surfaces of the first and second floor panels being disposed proximate to each other forming a joint; and a thermally activated solid adhesive interspersed between the coupling surfaces of the first and second floor panel. Methods of installing these systems are also described.
Public/Granted literature
- US20160168864A1 FLOORING SYSTEM Public/Granted day:2016-06-16
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