Described herein are flooring systems comprising: a first floor panel and a second floor panel, each of the first and second floor panels comprising: a top surface, a bottom surface, and a plurality of peripheral edges extending between the top and bottom surfaces; and a coupling surface formed on one peripheral edge; the coupling surfaces of the first and second floor panels being disposed proximate to each other forming a joint; and a thermally activated solid adhesive interspersed between the coupling surfaces of the first and second floor panel. Methods of installing these systems are also described.