Invention Grant
- Patent Title: Method of forming fins from different materials on a substrate
- Patent Title (中): 在基材上形成不同材料的翅片的方法
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Application No.: US13956398Application Date: 2013-08-01
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Publication No.: US09396931B2Publication Date: 2016-07-19
- Inventor: Stanley Seungchul Song , Zhongze Wang , Choh fei Yeap
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/02 ; H01L29/10 ; H01L21/8234 ; H01L21/8258 ; H01L21/84 ; H01L27/12
Abstract:
A method of forming fins of different materials includes providing a substrate with a layer of a first material having a top surface, masking a first portion of the substrate leaving a second portion of the substrate exposed, etching a first opening at the second portion, forming a body of a second material in the opening to a level of the top surface of the layer of the first material, removing the mask, and forming fins of the first material at the first portion and forming fins of the second material at the second portion. A finFET device having fins formed of at least two different materials is also disclosed.
Public/Granted literature
- US20150035019A1 METHOD OF FORMING FINS FROM DIFFERENT MATERIALS ON A SUBSTRATE Public/Granted day:2015-02-05
Information query
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