Invention Grant
- Patent Title: Wafer carrier including air filters
- Patent Title (中): 晶圆载体包括空气过滤器
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Application No.: US14635147Application Date: 2015-03-02
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Publication No.: US09396979B2Publication Date: 2016-07-19
- Inventor: Yeon-sik Choo , Soo-Jae Park , Jae-Heon Noh , Yong-Sang Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2014-0106985 20140818
- Main IPC: H01L21/673
- IPC: H01L21/673
Abstract:
A wafer carrier comprises a body part constructed and arranged to accommodate a wafer and including first and second layers which are stacked in sequence. A cover is mountable to the body part. A first air filter is positioned on the cover. A second air filter is positioned on a side of the body part. The second layer is positioned between the first layer and an inner region of the body part. A surface of the second layer facing the inner region is subjected to charge prevention processing.
Public/Granted literature
- US20160049320A1 WAFER CARRIER Public/Granted day:2016-02-18
Information query
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