Invention Grant
- Patent Title: Bonding device
- Patent Title (中): 粘接装置
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Application No.: US14106865Application Date: 2013-12-16
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Publication No.: US09397067B2Publication Date: 2016-07-19
- Inventor: Ding-Xiang Wang , Heng Duan
- Applicant: FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO., LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Zhejiang TW New Taipei
- Assignee: FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Zhejiang TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN201227314222U 20121227
- Main IPC: H01L21/48
- IPC: H01L21/48 ; B32B37/12 ; B29C65/78 ; H01L23/00 ; B32B37/00 ; F16B11/00 ; B32B37/04 ; B29L31/34
Abstract:
A bonding device includes a first feeding mechanism, a second feeding mechanism, a glue spraying mechanism positioned between the first feeding mechanism and the second feeding mechanism, and a bonding mechanism. The first feeding mechanism comprises a mounting frame and a transmission belt mounted on the mounting frame. The second feeding mechanism includes a support frame, a feeding member positioned on the support frame, a positioning plate mounted on the support frame and located below the feeding member, and a first driver connected to the positioning plate. The feeding member vertically defines at least one feeding groove. The positioning plate defines a matching groove matching with the first workpiece The bonding mechanism includes a second driver and a suction member connected to the second driver.
Public/Granted literature
- US20140182789A1 BONDING DEVICE Public/Granted day:2014-07-03
Information query
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