Invention Grant
- Patent Title: LED packages and manufacturing method thereof
- Patent Title (中): LED封装及其制造方法
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Application No.: US14203766Application Date: 2014-03-11
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Publication No.: US09397277B2Publication Date: 2016-07-19
- Inventor: Chen-Hsiu Lin
- Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED , LITE-ON TECHNOLOGY CORP.
- Applicant Address: CN Guangzhou TW Taipei
- Assignee: Lite-On Electronics (Guangzhou) Limited,Lite-On Technology Corp.
- Current Assignee: Lite-On Electronics (Guangzhou) Limited,Lite-On Technology Corp.
- Current Assignee Address: CN Guangzhou TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: CN201310095063 20130322
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L33/60 ; H01L33/52 ; H01L33/36 ; H01L21/78 ; H01L33/00 ; H01L23/00 ; H01L25/16 ; H01L33/48
Abstract:
A method of manufacturing LED packages includes the steps of: forming a conductive circuit layer on a substrate; screen printing a wall layer on the conductive circuit layer to form a trellis with a plurality of wall units, so that regions of the conductive circuit layer surrounded by the wall units are exposed; mounting and electrically connecting at least one LED die on the conductive circuit layer within each of the wall units; molding a transparent layer to cover the LED dies; and cutting along the wall units to form a plurality of LED packages.
Public/Granted literature
- US20140284641A1 LED PACKAGES AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-09-25
Information query
IPC分类:
