Invention Grant
US09397292B2 Methods for forming resistive switching memory elements by heating deposited layers
有权
通过加热沉积层形成电阻式开关存储元件的方法
- Patent Title: Methods for forming resistive switching memory elements by heating deposited layers
- Patent Title (中): 通过加热沉积层形成电阻式开关存储元件的方法
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Application No.: US14505128Application Date: 2014-10-02
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Publication No.: US09397292B2Publication Date: 2016-07-19
- Inventor: Pragati Kumar , Sean Barstow , Tony P. Chiang , Sunil Shanker
- Applicant: Intermolecular Inc.
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
Resistive switching nonvolatile memory elements are provided. A metal-containing layer and an oxide layer for a memory element can be heated using rapid thermal annealing techniques. During heating, the oxide layer may decompose and react with the metal-containing layer. Oxygen from the decomposing oxide layer may form a metal oxide with metal from the metal-containing layer. The resulting metal oxide may exhibit resistive switching for the resistive switching memory elements.
Public/Granted literature
- US20150056748A1 Methods for Forming Resistive Switching Memory Elements by Heating Deposited Layers Public/Granted day:2015-02-26
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