Invention Grant
- Patent Title: Near field communication module
- Patent Title (中): 近场通信模块
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Application No.: US14260285Application Date: 2014-04-24
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Publication No.: US09397386B2Publication Date: 2016-07-19
- Inventor: Kai-Min Lin , Si-Hua Chen
- Applicant: Kai-Min Lin , Si-Hua Chen
- Applicant Address: TW Taipei
- Assignee: ASUSTeK COMPUTER INC.
- Current Assignee: ASUSTeK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW103111527A 20140327
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/22 ; H01Q21/00 ; H01Q1/38 ; H01Q7/00
Abstract:
A near field communication module applied to an electronic device is provided. The near field communication module includes a flexible circuit board, a first sensing antenna and a second sensing antenna. The flexible circuit board includes a first part and a second part connected with each other. The first sensing antenna is disposed at the first part. The second sensing antenna is disposed at the second part. The first sensing antenna is connected to the second sensing antenna. After the flexible circuit board is bended, it is disposed at a side of the electronic device.
Public/Granted literature
- US20140320353A1 NEAR FIELD COMMUNICATION MODULE Public/Granted day:2014-10-30
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