Invention Grant
- Patent Title: Electric connecting apparatus
- Patent Title (中): 电连接装置
-
Application No.: US14302022Application Date: 2014-06-11
-
Publication No.: US09400309B2Publication Date: 2016-07-26
- Inventor: Hidehiro Kiyofuji , Tatsuo Inoue , Osamu Arai , Kenji Sasaki
- Applicant: Kabushiki Kaisha Nihon Micronics
- Applicant Address: JP Musashino-shi, Tokyo
- Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee Address: JP Musashino-shi, Tokyo
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Priority: JP2013-142391 20130708
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/28 ; G01R1/073

Abstract:
An apparatus includes a probe card having a probe board with a conductive path electrically connected to a tester and probes enabling to respectively contact connection pads of a semiconductor wafer on a chuck top and moving relatively to the chuck top, and an elastic heat conducting member arranged between a working surface of the chuck top or the semiconductor wafer on the working surface and the probe board. The elastic heat conducting member can abut on the working surface of the chuck top or the semiconductor wafer on the working surface and the probe board when the probes do not abut on the respective corresponding connection pads and is elastically deformable not to prevent abutment between the probes and the respective corresponding connection pads.
Public/Granted literature
- US20150008945A1 ELECTRIC CONNECTING APPARATUS Public/Granted day:2015-01-08
Information query