Invention Grant
- Patent Title: Electrostatic chuck mechanism and charged particle beam apparatus
- Patent Title (中): 静电吸盘机构和带电粒子束装置
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Application No.: US14626116Application Date: 2015-02-19
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Publication No.: US09401297B2Publication Date: 2016-07-26
- Inventor: Yasushi Ebizuka , Seiichiro Kanno , Masaya Yasukochi , Masakazu Takahashi , Naoya Ishigaki , Go Miya
- Applicant: Hitachi High-Technologies Corporation
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2014-050971 20140314
- Main IPC: H01J37/20
- IPC: H01J37/20 ; H01L21/683 ; H01J37/28 ; H01J37/244

Abstract:
Proposed are an electrostatic chuck mechanism and a charged particle beam apparatus including a first plane that is a plane of a side in which a sample is adsorbed, a first electrode to which a voltage for generating an adsorptive power between the first plane and the sample is applied, and a second electrode that is arranged in a position relatively separated from the sample toward the first plane and through which a virtual line that is perpendicular to the first plane and contacts an edge of the sample passes, wherein the first plane is formed so that a size in a plane direction of the first plane is smaller than that of the sample.
Public/Granted literature
- US20150262857A1 Electrostatic Chuck Mechanism and Charged Particle Beam Apparatus Public/Granted day:2015-09-17
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