Invention Grant
- Patent Title: Stack of integrated-circuit chips and electronic device
- Patent Title (中): 堆叠的集成电路芯片和电子设备
-
Application No.: US14723893Application Date: 2015-05-28
-
Publication No.: US09401349B2Publication Date: 2016-07-26
- Inventor: Angelo Crobu , Kenneth Fonk , Romain Coffy
- Applicant: STMicroelectronics (Grenoble 2) SAS , STMicroelectronics (Malta) Ltd , STMicroelectronics S.r.l.
- Applicant Address: FR Grenoble MT Kirkop IT Agrate Brianza
- Assignee: STMICROELECTRONICS (GRENOBLE 2) SAS,STMICROELECTRONICS (MALTA) LTD,STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS (GRENOBLE 2) SAS,STMICROELECTRONICS (MALTA) LTD,STMICROELECTRONICS S.R.L.
- Current Assignee Address: FR Grenoble MT Kirkop IT Agrate Brianza
- Agency: Gardere Wynne Sewell LLP
- Priority: FR1455350 20140612
- Main IPC: G01P15/08
- IPC: G01P15/08 ; H01L25/18 ; G01L19/14 ; H01L23/24 ; H01L23/00 ; H01L25/065 ; H01L23/31
Abstract:
A stack of chips is formed by a first integrated-circuit chip and a second integrated-circuit chip. The chips have opposing faces which are separated from each other by an interposed spacer. The spacer is fastened by adhesion to only one of the opposing faces. The opposing faces are fastened to each other by a local adhesive which is separate from spacer.
Public/Granted literature
- US20150364455A1 STACK OF INTEGRATED-CIRCUIT CHIPS AND ELECTRONIC DEVICE Public/Granted day:2015-12-17
Information query
IPC分类:
