Invention Grant
- Patent Title: Semiconductor device structure
- Patent Title (中): 半导体器件结构
-
Application No.: US14611843Application Date: 2015-02-02
-
Publication No.: US09401358B1Publication Date: 2016-07-26
- Inventor: Ching-Wen Hung , Chih-Sen Huang , Yi-Wei Chen
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Priority: TW104100523A 20150108
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L27/08 ; H01L27/06
Abstract:
A semiconductor device structure having at least one thin-film resistor structure is provided. Through the metal plug(s) or metal wirings located on different layers, a plurality of stripe segments of the thin-film resistor structure is electrically connected to ensure the thin-film resistor structure with the predetermined resistance and less averting areas in the layout design.
Public/Granted literature
- US20160204103A1 SEMICONDUCTOR DEVICE STRUCTURE Public/Granted day:2016-07-14
Information query
IPC分类:
