Invention Grant
- Patent Title: Layout pattern for 8T-SRAM and the manufacturing method thereof
- Patent Title (中): 8T-SRAM的布局图及其制造方法
-
Application No.: US14792636Application Date: 2015-07-07
-
Publication No.: US09401366B1Publication Date: 2016-07-26
- Inventor: Tien-Yu Lu , Chang-Hung Chen , Yu-Tse Kuo , Chun-Hsien Huang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: CN201510336560 20150617
- Main IPC: G11C11/00
- IPC: G11C11/00 ; H01L27/088 ; H01L27/11 ; H01L27/02 ; H01L29/06 ; G11C11/412 ; H01L21/84 ; H01L27/105 ; H01L29/423

Abstract:
The present invention provides a layout pattern of an 8-transistor static random access memory (8T-SRAM), at least including a first diffusion region, a second diffusion region and a third diffusion region disposed on a substrate, a critical dimension region being disposed between the first diffusion region and the third diffusion region. The critical dimension region directly contacts the first diffusion region and the third diffusion region, a first extra diffusion region, a second extra diffusion region and a third extra diffusion region disposed surrounding and directly contacting the first diffusion region, the second diffusion region and the third diffusion region respectively. The first, the second and the third extra diffusion region are not disposed within the critical dimension region.
Information query