Invention Grant
- Patent Title: Down the bore with open windows and manufacturing thereof
- Patent Title (中): 用敞开的窗户向下镗孔并制造
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Application No.: US14695036Application Date: 2015-04-23
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Publication No.: US09401562B2Publication Date: 2016-07-26
- Inventor: Andrew J Ries , Jeffrey A Swanson , George A Patras
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Carol F. Barry
- Main IPC: A61N1/00
- IPC: A61N1/00 ; H01R13/52 ; A61N1/375 ; H01R24/58 ; A61N1/05 ; B29C45/14 ; H01R13/66 ; H01R107/00 ; B29L31/00

Abstract:
An implantable medical device connector assembly and method of manufacture include a molded, insulative shell having an inner surface forming a connector bore, a circuit member including one or more traces extending through apertures in the connector shell. One or more conductive members, positioned along the connector bore, are electrically coupled to the traces. The sealing members are positioned between the conductive members.
Public/Granted literature
- US20150306402A1 DOWN THE BORE WITH OPEN WINDOWS AND MANUFACTURING THEREOF Public/Granted day:2015-10-29
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